EUV Lithography: ASML will shoot tin droplets 300,000 times per second

ASML's exposure systems are expected to expose around 50 percent more wafers by 2030 than before. This requires complex ...
DIGITIMES

ASML lifts EUV power to 1,000W, targets 50% chip output gain by 2030

ASML has unveiled an extreme ultraviolet (EUV) upgrade that could raise chip output per scanner by up to 50% by 2030, without expanding cleanroom space or adding new tools.
Seeking Alpha

ASML: A Winner In The AI Arms Race

ASML delivered strong Q3 earnings, with robust system bookings, but missed on revenue. ASML's lithography machine demand reflects ongoing CapEx momentum driven by AI and hyperscaler investments in ...
Forbes

ASML’s 50% Rally: More Than Just AI Hype?

BERLIN, GERMANY - SEPTEMBER 18: The logo of ASML hangs over an office building the company occupies near its production campus, where it inaugurated the expansion of ASML wafer production components ...