Single-component thermal conductive silica gel (S-TCSG) has the properties of low stress, high thermal conductivity and strong bonding. It is a new type of heat conductive material for heat ...
Pulsed current has been used to eliminate residual stress and prevent springback defects in thin-walled components. For AZ31B magnesium alloy and QP980 high-strength steel, the athermal effect of ...
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