ST. FLORIAN, Austria, March 14, 2018 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and IBM (NYSE ...

Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...

The temporary bonding and debonding equipment uses a hybrid laser debonding solution with an industry-leading throughput of over 60 to 100 wafers per hour. It also supports wafer thinning to less than ...

AUSTIN, TX, UNITED STATES, June 26, 2025 /EINPresswire.com/ -- Resonac Corporation and PulseForge, Inc. are pleased to announce a strategic partnership to advance and ...

KAOHSIUNG, Aug. 28, 2025 /PRNewswire/ -- As AI, HPC, and 5G drive semiconductor innovation, advanced packaging has become the next strategic focus. Yole Group projects the market to exceed USD 50 ...

“For more than 15 years, EVG has provided leading-edge temporary bonding and debonding solutions to our customers,” commented Paul Lindner, EVG's executive technology director. “The experience and ...

TOKYO–(BUSINESS WIRE)–Resonac Corporation (TOKYO:4004) (President: Hidehito Takahashi, hereinafter “Resonac”) has developed a temporary bonding film to be used for supporting a wafer on a glass ...