With advancement in technology, processors and other high-speed digital components such as CPUs, GPUs, ASICs, and FPGAs demand increasingly higher power, which means voltage regulators need to be able ...
The next big leap in CPU design won’t come from adding more cores, chasing smaller nodes, or stacking additional chiplets onto one CPU. That's not to say that things like AMD's 3D V-Cache aren't good, ...
Samsung’s chip division, aka Samsung Foundry, is coming up with an innovative method to manufacture chips with smaller node sizes. As per a report by the Korean website Chosun Biz, Samsung Foundry ...
The industry’s insatiable need for power in high-performance computing (HPC) is creating problems for test cells, which need to deliver very high currents at very consistent voltage levels through the ...
The virtual study demonstrated that the SABC approach to backside power minimizes EPE and over-etch variations in the TSV ...
Samsung Foundry will be using its new SF2 (2nm-class) manufacturing process as its first with a backside power delivery network (BSPDN), according to the latest reports. Chosun.com is reporting that ...
SUNNYVALE, Calif.--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX) (TAIEX: 3711), today announced that it has introduced ...
The AI boom is driving up the power demands of CPUs, GPUs, and other high-performance SoCs in data centers—and they show no signs of slowing down. Today, the most advanced AI chips are bordered on ...
SANTA CLARA, Calif., May 01, 2025 (GLOBE NEWSWIRE) -- Movellus today announced the industry’s first on-chip sensor for power delivery network (PDN) characterization and monitoring. Power integrity is ...
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