Efficient management and exploitation of thermal energy is key for many engineering applications. Greater understanding and control of thermal processes, such as thermal energy harvesting, storage and ...

Fluid mechanics and thermal engineering concern the behaviour of liquids and gases in motion and the management of thermal energy within those flows. Central to fluid mechanics are the conservation ...

Metasurfaces featuring tailored silver nanocubes could allow thermal photodetectors to approach speeds akin to traditional ...

Assistant Professor Yan Wang of the Department of Mechanical Engineering has received a CAREER award to advance research to more fully understand phonon wave behaviors, contribute to strategies to ...

Researchers reviewed 110 studies on cold thermal energy storage in liquid-air energy storage, finding that cold storage performance has a far greater impact on system efficiency than previously ...

Researchers at the NYU Tandon School of Engineering have developed a model using zeolite-based ...

POCATELLO, Idaho (KIFI) - An Idaho State University professor has been selected for an editor post with Frontiers in Thermal Engineering. Recently, Rajib Mahamud, assistant professor of mechanical ...

Embedding chips into stacked-die assemblies is creating thermal dissipation challenges that can reduce the reliability and lifespan of these devices, a growing problem as chipmakers begin cramming ...

The impressive capabilities of twenty-first century medical technology, from imaging equipment to surgical instruments and automated immunoassays, are in many ways a tribute to the advances in ...

Thermal engineering research has increasingly focused on innovative system design and optimization to address global challenges in energy efficiency, ...

The research of the Multiscale Thermal Science Laboratory (MTSL) focuses on the fundamental understanding of thermal transport phenomena at the interfaces between material phases and from macro to ...

Managing thermal and mechanical stress in multi-die assemblies will require a detailed knowledge of how and where a device will be used, how it will be packaged, and where stresses could cause ...