IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

A new technical paper titled “Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects” was published by researchers at Siemens EDA, D2S, and Univ.

The intelligence community (IC) published its first-ever open-source intelligence (OSINT) strategy in March. It is a big-picture, priority setting document—an essential, basic step to re-launch OSINT ...

Semiconductors are the essential component fueling the growth of industries such as automotive, renewable energy, communications, information technology, defense, and consumer electronics. The rise of ...

Collecting and combining diverse data types from different manufacturing processes can play a significant role in improving semiconductor yield, quality, and reliability, but making that happen ...

Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...