SEMICON West – SAN FRANCISCO — October 13, 2026 — Global 300mm front-end fab equipment spending is projected to reach $149 ...

Oct-15th-2025-- GlobalFoundries has been selected as the technology provider and operator for two new semiconductor fabs ...

Tessolve’s $75 million raise highlights the growing strategic importance of outsourced semiconductor engineering. Chip ...

ElectraIC proudly announces the launch of the NEXUS N1 Series, a new family of AI Mini Supercomputers designed to accelerate ...

Advanced packaging has become the place where AI system performance is won or lost. High-end performance packaging revenue is ...

Faraday Technology Corporation (TWSE: 3035), a leading provider of ASIC design services and IP, today announced the ...

Vanguard International Semiconductor Corporation (VIS) and GLOBALFOUNDRIES (GF) today announced that VIS will acquire GF’s Fab 3E in Tampines, Singapore. The transaction includes buildings, facilities ...

That has made chiplets, HBM, silicon interposers, redistribution layers, bridges and 3D stacking increasingly important.

What Is a QFN Package? QFN stands for Quad Flat No-Lead. It belongs to the broader family of bottom-termination components (BTCs). Instead of using leads that extend outside the package, the ...

GlobalFoundries and TSMC have signed a $2 billion manufacturing agreement that will establish a U.S.-based source of silicon interposers for TSMC’s CoWoS advan ...

For semiconductor products entering production today, silicon remains the strongest choice when maximum routing density, ...

Imagine a world where every electronic device is tailored to its purpose with pinpoint precision. Custom ASICs, or Application-Specific Integrated Circuits, makes this a reality. Custom ASICs ...