Design And Reuse

Can Smart Factory Solutions Solve the Visibility Challenges Created by Legacy Systems?

That is why operational visibility matters in legacy plants, and how smart factory solutions become centre part to solve it.
Design And Reuse

Siemens extends next-generation data acquisition portfolio for modern physical testing with Simcenter SCADAS ES

Integrates with third-party analysis software using Test Connect to give testing teams greater flexibility ...
Design And Reuse

Global 300mm Fab Equipment Spending to Reach $227 Billion in 2029 as Buildout Accelerates

Global 300 mm front-end fab equipment spending is projected to reach $149 billion in 2026, up 31% year-over-year, SEMI reported today in its latest 300 mm Fab Outlook. Investment is expected to ...
Design And Reuse

NVIDIA deepens France AI push with new startup investments and sovereign infrastructure

France is scaling agentic AI from ambition to deployment, with NVIDIA backing new startups and sovereign infrastructure while companies across healthcare, finance, telecom and sci ...
Design And Reuse

ForwardEdge ASIC Announces UCIe 3.0 IP Solution to Accelerate Next-Generation Chiplet-Based ASIC Innovation

St. Paul, Minnesota — ForwardEdge ASIC, a leading provider of custom ASIC design and silicon solutions, today announced the availability of its new UCIe 3.0 IP solution, designed to help semiconductor ...
Design And Reuse

Samsung Unveils Yongin Cluster Plan as SK hynix Touts Next-Gen Chips

Samsung Electronics took part in the Semiconductor Exhibition (SEDEX) 2026, hosted by the Korea Semiconductor Industry Association, which opened on the 14th at COEX in Seoul's Gangnam district, ...
Design And Reuse

GlobalFoundries selected to operate two new semiconductor fabs in New York under landmark U.S.-Japan initiative

GlobalFoundries (Nasdaq: GFS) (GF) today announced it has been selected as the technology provider and operator for two new semiconductor manufacturing facilities (“fabs”) at its Malta, New York, site ...
Design And Reuse

INTERA Launches EAGLE Cognit, Bringing Ultra-Low-Power Near-Memory AI Acceleration to Next-Generation Edge Devices

BARCELONA, Spain — INTERA, a developer of advanced semiconductor intellectual property (IP) for Edge AI acceleration, today announced the launch of EAGLE Cognit, a new near-memory AI accelerator ...
Design And Reuse

intoPIX to Demonstrate JPEG XS, IPMX and SMPTE ST 2110 Solutions at NAB Show New York 2026

Louvain-la-Neuve, Belgium — intoPIX will exhibit at NAB Show New York 2026 (Booth #932, Javits Center, October 21–22), demonstrating its JPEG XS codec portfolio and its IPMX-c ...
Design And Reuse

BrainChip Launches Sequora: Edge AI That Doesn’t Just Recognize — It Understands and Responds

BrainChip Holdings Ltd. (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), a global leader in ultra-low-power, fully digital, event-based neuromorphic AI, today announced BrainChip Sequora™ Core IP, a processor IP ...
Design And Reuse

Quintauris and Microchip Technology join forces to grow RISC-V® adoption

Engagement also brings Quintauris benchmarking and software integration services to Microchip’s RISC-V development pipeline ...
Design And Reuse

PUFsecurity Puts Silicon Root of Trust at the Center of AI Agent Security

Hardware-based identity and attestation are critical to protecting credentials and workloads as AI agents gain autonomy across data centers and edge devices. AI agents that book travel, send emails, ...