Nexperia has introduced a new portfolio of logic ICs in tiny automotive-qualified MicroPak XSON5 leadless packaging. Miniaturised logic ICs are essential for space-constrained applications, including ...

Seb Springall is a seasoned editor at Electropages, specialising in the product news sections. With a keen eye for the latest advancements in the tech industry, Seb curates and oversees content that ...

Hightech Innovation Center in Munich-Freiham. The company specialises in transformers for switch-mode power supplies and customised inductive components and is part of the Würth Elektronik eiSos Group ...

Wafer-scale 2D perovskite oxides transform motion recognition with enhanced speed, precision, and scalability in ...

Skin sensors measure emotional states like fear and joy, paving the way for technology that adapts to your feelings and needs ...

Mouser has announced a new eBook in collaboration with TE Connectivity and Microchip Technology. The eBook presents an in-depth look at how zonal architecture is helping designers keep pace with the ...

GDT series. The products offered in the Bourns Model GDT21 Series are two-electrode devices created to provide maximum impulse voltage limiting in a space-saving surface mount package. The company ...

To provide higher efficiency and power density for industrial applications,, Inc. has introduced a new 40V TrenchFET Gen V n-channel power MOSFET in the PowerPAK 10x12 package with best-in-class ...

LG's DMS solution is created to fit seamlessly into various software and hardware configurations, offering automotive OEMs considerable flexibility when developing new vehicle models. This flexibility ...

Southco's new AC-50 Squeeze Handle Actuator features a dual cable pull system, allowing greater freedom in actuator positioning and secure multi-point latching on larger panels. This provides end ...

Commenting on Delta’s innovative solar solutions, Andreas Hoischen, senior director of the Photovoltaic Inverters Business Unit at Delta EMEA, said: “As we shift towards renewable energy, large ground ...

KIOXIA Europe GmbH, has announced its UFS Ver. 4.0 embedded flash memory devices designed for automotive applications have received Automotive SPICE (ASPICE) Capacity Level 2 (CL2) certification. The ...