New York’s 27-year-old semiconductor outreach consortium unveiled its new name at SEMICON West, swapping “nanotech” for a ...

Wavefront phase imaging captures 16 million data points in a single shot, aiming at in-line shape and stress measurement on ...

SEMI and Semiconductor Digest today announced that the SonoFlex Acoustic System from Nordson Test & Inspection (Booth 5844) has won the Best of West award to be presented at SEMICON West 2026.

Great Lakes Semiconductor (GLS) today announced the first project on its Great American ChipForge platform, launched under the company's Innovation Funnel initiative.

President Trump's agreement with Japan unlocks up to $21 billion investment to expand foundational semiconductor production, ...

Collaboration aims to accelerate development of the manufacturing and design capabilities needed for future nanostack ...

NVIDIA today announced semiconductor leaders are adopting NVIDIA CUDA-X libraries — including the new NVIDIA cuPotential library, which developers can use to build AI agents that simulate how atoms ...

When SEMI asks member companies what could hold back their growth, the number one answer is talent, Joe Stockunas, president of SEMI Americas, said at Monday’s SEMICON West press conference.

ChipAgents, the agentic AI platform for semiconductor engineering, today introduced Build-A-Chip-Bench, a benchmark built in collaboration with NVIDIA designed to test whether AI agents can carry an ...

Nikon Corporation will release the DSP-110 digital lithography system for semiconductor advanced packaging in April 2027.

Global 300mm front-end fab equipment spending is projected to reach $149 billion in 2026, up 31% year-over-year, SEMI ...

Advanced packaging has a bigger place at SEMICON West than ever, with three days of packaging content on this year’s program, and SEMI is building a global home for the topic through its Advanced ...