Semiconductor Packaging News3h
Intel and Commerce Department close to finalizing roughly $8 billion CHIPS Act grant, source says
Intel and Commerce Department close to finalizing roughly $8 billion CHIPS Act grant, source says: Summary Intel is nearing an $8 billion CHIPS Act grant to boost factory-building ...
Semiconductor Packaging News4h
Nvidia meets Chinese trade negotiator as fresh US chip sanctions loom
Nvidia meets Chinese trade negotiator as fresh US chip sanctions loom: Summary Beijing's trade negotiator met Nvidia's global operations head to discuss opportunities and collabor ...
Semiconductor Packaging News4h
Impending chip moves expose US hypocrisy again
The Biden administration plans to impose stricter export controls on China this week, potentially targeting 200 Chinese chip companies. Aimed at restricting semiconductor access, these moves face ...
Semiconductor Packaging News4h
Can Malta’s Chip Initiative Stimulate Another Silicon Valley Cluster?
Minister Silvio Schembri highlighted this initiative as a strategic move to boost innovation, foster academia-industry collaboration, and advance Malta’s competitiveness globally. EE Times Read the ...
Semiconductor Packaging News4h
Global wafer foundry industry to see over 10% CAGR in revenues from 2024-2029, says DIGITIMES Research
Global wafer foundry industry to see over 10% CAGR in revenues from 2024-2029, says DIGITIMES Research: Summary The global wafer foundry market will grow 11.5% annually, reaching ...
Semiconductor Packaging News4h
Global notebook shipments rise in 3Q24 before decline in 4Q24, says DIGITIMES Research
Global notebook shipments rise in 3Q24 before decline in 4Q24, says DIGITIMES Research: Summary Global notebook shipments grew 5.8% in Q3 2024, driven by gaming, AI, and MacBooks, ...
Semiconductor Packaging News4h
Research Bits: Nov. 25
Summary Lawrence Livermore researchers developed a 3D-printable silicone foam combining mechanical and ESD protection for electronics packaging. Using carb ...
Semiconductor Packaging News4h
TSMC to push US to No. 2 in IC production in 2027
TSMC's $65 billion investment in Arizona aims to boost the U.S. share of advanced semiconductor production from 9% to 21% by 2027, according to TrendForce. Taiwan will remain the leader, but its share ...
Semiconductor Packaging News20h
Electromigration Performance Of Fine-Line Cu RDL For HDFO Packaging
The study highlights High-Density Fan-Out (HDFO) packages' fine copper redistribution layer (Cu RDL) reliability under electromigration (EM). Findings include distinct failure modes, resistance ...
Semiconductor Packaging News1d
Huawei aims to mass-produce newest AI chip
Summary Huawei plans to mass-produce its advanced AI chip, the Ascend 910C, in early 2024 despite US restrictions limiting production capacity. With yields below commercial viability and supply delays ...
Semiconductor Packaging News1d
IC design firms bullish on 2025, but 1Q25 outlook remains uncertain
IC design firms bullish on 2025, but 1Q25 outlook remains uncertain: Summary IC design companies are optimistic about 2025, as highlighted in recent earnings calls. Industry leade ...
Semiconductor Packaging News1d
Quantum Computing Could Transform Smart Cities
Summary The Barcelona Deep Tech Summit showcased quantum computing's transformative potential for smart cities. Experts and startups demonstrated its role in optimizing traffic, energy, and AI systems ...